KEA Camera Development Kit

Kickstart your product development journey

Our KEA ToF CDK is designed to accelerate and simplify the integration of 3D depth sensing into your next product. Feature rich and maximally flexible.

Photo of the KEA Camera Development Kit

Clean 3D depth sensing

factory calibrated out of the box ready for your application

Optimise performance

with Chronoptics' software-defined 3D ISP​

Simplify prototyping

with intuitive configuration tools & SDK

Reduce time to market

by leveraging our ToF tech and know-how

Deploy at the edge

with broad feature set and on-camera processing

TOF VIewer

Our graphical interface for configuration enables users to create clean point clouds quickly using our full depth ISP.

User-friendly graphical interface built on top of our API
Depth ISP configuration & image filtering options
Real-time depth, intensity & RGB display
Edge Capabilities
Yocto for running original code on-camera
Coral for machine learning inference via USB

The ToF Viewer ships with our KEA CDK and integrates with all major platforms.


Simultaneously outputs 3D depth
infrared brightness & RGB images

Multiple interface & connectivity options including Gigabit Ethernet, USB, HDMI

Software-defined depth specifications
with embedded Chronoptics 3D ISP

Modular & flexible design enabling easy customisation & rapid prototyping

Deploy application layer code on
camera for a complete edge solution

Comprehensive API support for seamless integration — C, C++, Python, Matlab, ROS​

Base Specification

Operating Distance​

0.4m — 15m

[depending on operating conditions]

Ambient Light Immunity​

Works Outdoors in daylight conditions

Max Frame Rate​

40 depth FPS @ VGA
120 depth fps @ qvga


os support

linux, windows, mac

middleware support

run your own code on camera with yocto

api support

c, c++, python, matlab, ros, opencv, pcl


comprehensive visualiser & config tools


1/4"-20 or m4


100mm x 40mm x 35mm

[W x H x D]


usb 3.0, gigabit ethernet

Colour Camera​

optional 2MP RGB CAMERA



hdmi, usb (host), uart

edge processing

native or using usb ai accelerator

output data

raw, radial, x y z, intensity (ir brightness), rgb (optional)

depth processing​

embedded on camera, or host computer


nxp 8mq

field of view

67° (H) x 51° (V)



ams OSRAM BIDOS® VCSELs; 940 nm​

3D Resolution

640 x 480 (vga) depth pixels

melexis mlx75027

Let’s work together